導航
PCB manufacturing Capacity, Number of layers up to 16, up to 1016*610mm size, minimum line space 0.076mm, Min. finished hole size 0.15mm.

Our Process Capability

Item Capability Item Capability
Solder PastePrinting Accuracy:,±0.025mm Wave Soldering Nitrogen source: external
Max. speed: 150mm/sec Speed: 5in2 /sec (60FOV/sec)
PCB max. area: 400*310mm Temperature accuracy: ±1°C
PCB thickness: 0.2-6mm Lead free compatible
SMT Accuracy: ±0.03mm AOI
Speed: 0.17sec/pc Accuracy: ±0.0024mm
PCB max. area: 350*350mm Speed: 5in2 /sec (60FOV/sec)
Available part: 0201 chip to 35*35mm PCB max. area:300*300mm
Accuracy: ±0.05mm Available component: 0201 chip and fine pitch
PCB max. area: 350*350mm X-ray,Inspection
Available part: 0402 chips to 14mm (H 12mm) BGA void(0.5mm distance between Ball)
Minimum SMD resistor and capacitor: 0201 Solderability inner shielding
Minimum BGA R-VTx: 0.15mm BGA Rework
Nitrogen source: external Nitrogen source: NA
Reflow Soldering Nitrogen source: external PCB max. size: 350mm
PCB max. size: 400*330mm Temperature accuracy: ±1°C
Temperature accuracy: ±4°C Lead free compatible
Zones: 8
SMD Production line 1 ● NO. A Line = 2,450,000 points/day SMD Production line 3 ● NO. C Line = 2,450,000 points/day
SMD Production line 2 ● NO. B Line = 1,580,000 points/day SMD Production line 4 ● NO. D Line = 4,400,000 points/day
SMD Totally production line Total =  10,900,000 points/day  

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