導航

PCB Production Process

  • 1
    Lamination
  • 2
    Inner Dry Film Imaging
  • 3
    Inner Etching(Inner Des)
  • 4
    Inner Layer Inspection(100%)
  • 5
    Brown Oxide
  • 6
    Pressing(stack-up)
  • 7
    Drilling
  • 8
    PTH&VCP
  • 9
    Outer Dry Film imaging
  • 10
    Pattern Plating
  • 11
    Outer Etching(Outer test)
  • 12
    Outer Layer Inspection(100%)
  • 13
    Solder Mask
  • 14
    Component Mark
  • 15
    HASL/ENIG/OSP/ETC
  • 16
    Profile
  • 17
    V-cut
  • 18
    E-Test/Fly-probe
  • 19
    Final Audit
  • 20
    Packing/shipment Audit/Shipment
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